1/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. cmos ldo regulators fo r portable equipments 1ch 150ma cmos ldo regulators bh nb1whfv series description the bh nb1whfv series is a line of 150 ma output, high-perfo rmance cmos regulators that deliver a high ripple rejection ratio of 80 db (typ., 1 khz). they are ideal for use in high-performance, analog applic ations and offer improved line regulation, load regulation, and noise characteristics. using the ultra-small hvsof5 package, which features a built-in heat sink, contributes to space-saving application designs. features 1) high accuracy output voltage: 1% 2) high ripple rejection ratio: 80 db (typ., 1 khz) 3) stable with ceramic capacitors 4) low bias current: 60 a 5) output voltage on/off control 6) built-in overcurrent and thermal shutdown circuits 7) ultra-small hvsof5 power package applications battery-driven portable devices, etc. product line ? 150 ma bh nb1whfv series product name 2.5 2.8 2.85 2.9 3.0 3.1 3.3 package bh nb1whfv hvsof5 model name: bh nb1w a b symbol description a output voltage specification output voltage (v) output voltage (v) 25 2.5 v (typ.) 30 3.0 v (typ.) 28 2.8 v (typ.) 31 3.1 v (typ.) 2j 2.85 v (typ.) 33 3.3 v (typ.) 29 2.9 v (typ.) b package hfv: hvsof5 no.11020ebt04
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technical note bh
technical note bh nb1whfv series 4/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. 2.40 2.45 2.50 2.55 2.60 -5 0 - 25 0 2 5 5 0 75 10 0 temp[ ] output voltage vout[v] 2.90 2.95 3.00 3.05 3.10 -50-25 0 255075100 temp[ ] ou tpu t vo ltag e vo ut[v ] 3.20 3.25 3.30 3.35 3.40 -50 -25 0 25 50 75 100 temp[ ] output voltage vout[v] 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m fig.19 load response (co = 2.2 f) (bh25nb1whfv) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.20 load response (co = 2.2 f) (bh30nb1whfv) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.21 load response (co = 2.2 f) (bh33nb1whfv) iout = 1 ma 30 ma vout 50 mv / div 100 s / div fig.22 output voltage rise time (bh25nb1whfv) stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f fig.23 output voltage rise time (bh30nb1whfv) fig.24 output voltage rise time (bh33nb1whfv) stby vout 1 v / div 100 s / div 1 v / div co = 1 f co = 2.2 f co = 10 f fig.13 output voltage vs temperature (bh25nb1whfv) fig.14 output voltage vs temperature (bh30nb1whfv) fig.15 output voltage vs temperature (bh33nb1whfv) fig.16 ripple rejection (bh25nb1whfv) fig.17 ripple rejection (bh30nb1whfv) fig.18 ripple rejection (bh33nb1whfv) iout=1ma iout=1ma co=2.2 f io=10ma iout=1ma 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m co=2.2 f io=10ma 10 20 30 40 50 60 70 80 90 frequency f[hz] ripple rejection r.r.[db] 100 1 k 10 k 100 1 m co=2.2 f io=10ma
technical note bh nb1whfv series 5/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. block diagram, recommended circuit diagram, and pin assignment diagram pin no. symbol function 1 stby output voltage on/off control (high: on, low: off) 2 gnd ground 3 v in power supply input 4 v out voltage output 5 n.c. no connect power dissipation (pd) 1. power dissipation (pd) power dissipation calculations include estimates of power dissi pation characteristics and internal ic power consumption, and should be treated as guidelines. in the event that the ic is used in an environment where this power dissipation is exceeded, the attendant rise in the junction temperature will trigger the therma l shutdown circuit, reducing the current capacity and otherwise degrading the ic's design performance. allo w for sufficient margins so that this power dissipation is not exceeded during ic operation. calculating the maximum internal ic power consumption (p max ) p max = (v in ? v out ) ? i out (max.) v in : input voltage v out : output voltage i out (max): max. output current 2. power dissipation/power dissipation reduction (pd) hvsof5 *circuit design should allow a sufficient margin for the temperature range so that pmax < pd. input output capacitors it is recommended to insert bypass capacitors between inpu t and gnd pins, positioning them as close to the pins as possible. these capacitors will be used when the power supply impedance increases or when long wiring paths are used, so they should be checked once the ic has been mounted. ceramic capacitors generally have temperature and dc bias char acteristics. when selecting ceramic capacitors, use x5r or x7r, or better models that offer good temperature and dc bias characteristics and high tolerant voltages. typical ceramic capacitor characteristics 0 20 40 60 80 100 120 01234 dc bias vdc[v] capacitance rate of change [%] 70 75 80 85 90 95 10 0 01234 dc bias vdc[v] capacitance rate of change [%] 0 20 40 60 80 10 0 12 0 -25 0 25 50 75 temp[ ] ca pa cita nc e ra te o f ch an g e [%] 50 v tolerance 16 v tolerance 10 v tolerance 50 v tolerance 16 v tolerance 10 v tolerance y5v x7r x5r fig.27 capacitance vs bias (y5v) fig.28 capacitance vs bias (x5r, x7r) fig.29 capacitance vs temperature ( x5r, x7r, y5v ) 0 0.2 0.4 0.6 0 25 50 75 100 125 ta[ ] pd[w] board: 70 mm ? 70 mm ? 1.6 mm material: glass epoxy pcb 410 mw fig. 26 hvsof5 power dissipation/pow er dissipation reduc tion (example) fig.25 cin ? ? ? 0.1f co ? ? ? 2.2f bh nb1whfv thermal protection over current protection voltage reference control block vout n.c. vin vin cin gnd stby vstb vout co 3 2 1 5 4
technical note bh nb1whfv series 6/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. output capacitors mounting input capacitor between input pin and gnd(as close to pin as possible), and also output capacitor between output pin and gnd(as close to pin as possible) is recommended. t he input capacitor reduces the out put impedance of the voltage supply source connected to the vcc. the higher value the output capacitor goes, the more stable the whole operation becomes. this leads to high load transient response. please confirm the whole operation on actual application board. generally, ceramic capacitor has wide range of tolerance, tem perature coefficient, and dc bias characteristic. and also its value goes lower as time progresses. please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers. bh nb1whfv operation notes 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. 2. thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. 3. inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. 4. thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit is designed only to shut the ic off to prevent r unaway thermal operation. it is not designed to protect the ic or guar antee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. 5. overcurrent protection circuit the ic incorporates a built-in overcurrent protection circuit that operates accordi ng to the output current capacity. this circuit serves to protect the ic from dam age when the load is shorted. the protecti on circuit is designed to limit current flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other component. these protection circuits are effective in preventing damage due to sudden and unexpected accidents. however, the ic should not be used in ap plications characterized by the contin uous operation or transitioning of the protection circuits. at the time of thermal designing, keep in mind that the current capab ility has negative characteristics to temperatures. 6. action in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic fiel d as doing so may cause the ic to malfunction. 7. ground wiring pattern when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 0.01 0.1 1 10 100 0 50 100 150 output current i out [ma] esr[ ? ] stable region fig.30 stable operation region (example) c out = 2.2 f ta = +25c
technical note bh nb1whfv series 7/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. 8. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 9. back current in applications where the ic may be exposed to back current fl ow, it is recommended to create a path to dissipate this current by inserting a bypass diode between the vin and vout pins. 10. testing on application boards when testing the ic on an application board, connecting a capa citor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precauti on when transporting or storing the ic. 11. regarding input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with t he n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of th e ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. fig.32 example of ic structure fig. 31 example bypass diode connection vin stby gnd out back current resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a parasitic element pin b other adjacent elements e b c gnd parasitic element
technical note bh nb1whfv series 8/8 www.rohm.com 2011.01 - rev.b ? 2011 rohm co., ltd. all rights reserved. ordering part number b h 2 5 n b 1 w h f v - t r part no. output voltage 25:2.5 v 28:2.8 v 2j:2.85 v 29:2.9 v 30:3.0 v 31:3.1 v 33:3.3 v series nb1 : high ripple rejection shutdown switch w : includes switch package hfv : hvsof5 packaging and forming specification tr: embossed tape and reel (unit : mm) hvsof5 s 0.08 m 0.1 s 4 321 5 (0.05) 1.60.05 1.00.05 1.60.05 1.2 0.05 (max 1.28 include burr) 45 32 1 (0.8) (0.91) (0.3) (0.41) 0.2max 0.130.05 0.220.05 0.6max 0.5 0.02 +0.03 ?0.02 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
r1120 a www.rohm.com ? 2011 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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